Molex Showcases High-Speed Interconnect Solutions at ECOC 2011

8th September 2011
Posted By : ES Admin
Molex Showcases High-Speed Interconnect Solutions at ECOC 2011

Molex will demonstrate and showcase a wide range of innovative fibre optic interconnect solutions and complete sub-systems optimised for high-speed communications at ECOC – the largest European optical communications event and the meeting place for everyone in the fibre optic communication technology industry.

Providing the longest link distance and lowest power consumption on the market today, the Quad Small Form-factor Pluggable (QSFP+) Active Optical Cable (AOC) assemblies can achieve total bandwidths of 40Gbps over long reaches of up to 4km (2.49 miles) using only 0.78W per cable end. By improving overall data centre power consumption, additional ports can be deployed, resulting in increased connectivity options and overall cost savings.

Molex announces sampling avaibility of it’s QSFP+ FDR version with 4x 14Gbps per lane, which will be available in late 2011 – this supports the QSFP+ interface InfiniBand† Fourteen Gigabit Data Rate (FDR) standard.

For next-generation high-density applications found in telecommunications, data networking, test and measurement and medical diagnostic equipment, Molex has developed the z-Quad Small Form-factor Pluggable Plus (zQSFP+) interconnect solution. The end-to-end system includes Surface Mount Technology (SMT) connectors, electromagnetic interference (EMI) shielding cages, passive copper cable assemblies and Active Optical Cable (AOC) assemblies. For the Extended Data Rate (EDR) standard, with a speed of 25Gbps per lane, Molex is targeting sampling availbility of an 100Gbps zQSFP+ EDR version (4x 25Gbps) AOC in mid-2012.

For Remote Radio Head applications the Molex Quick Mate Duplex (QMD) LC Optical Connector includes an innovative one-step, push-pull configuration that can be mated directly to Small Form-factor Pluggable (SFP) transceivers. Molex brings the QMD solution to its customers through a licensing agreement with Radiall* SA for its next generation One Step Interconnection Solution (OSIS) fibre to the antenna interconnect technology, insuring full interoperability of both manufacturers’ product offerings.

Throughout the exhibition, experts from Molex will be on hand to provide visitors to the stand (1436) with advice and guidance on selecting interconnect solutions for their own specific applications.

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