Power busbar coupler boasts small footprint

14th March 2022
Posted By : Mick Elliott
Power busbar coupler boasts small footprint

Interplex has released the new BusMate Power Busbar Coupler, which is designed to maximise configuration options for product engineers to integrate busbars in power devices.

BusMate provides a compact, pluggable, and economical interface for connecting busbars to a variety of small PCBs, using either SMT or Press-Fit configurations.

The technology can support a wide range of designs, including blade-to-blade, moulded connectors, busbar-to-SMT and other applications.

This gives engineers a highly reliable and assembly-friendly solution for new power designs.

Key features of the Power Busbar Coupler include:

      • Small footprint: 8.4 x 6 x 9.9mm (X, Y, Z) 

      • Large ampacity-to-size ratio 

      • Rated up to 80 Amps, or higher by using active or passive cooling designs  

      • Floating Contact Technology accommodates large assembly tolerances: +/-0.8                 Mating Blade Offset or Twist 

      • High temperature construction: 150°C 

      • Up to three re-mate cycles 

      • Configurable for: Board-to-Blade, Board-to-Board, or Blade-to-Blade 

According to Joe Lynch, Product Portfolio Director, “As smaller and more powerful product designs require compact, efficient, and reliable busbar interconnects for higher power densities, the BusMate Power Busbar Coupler is giving designers new options. BusMate’s design flexibility and Floating Contact Technology enables usage across a wide range of requirements, while assuring excellent electrical performance and cost-effective assembly.” 

BusMate is especially helpful for applications such as motors & pumps, hybrid vehicle power systems, electric power steering, charging systems, power mechatronics, Brushless Servo Motor (BLDC) systems, Traction-Drive Inverter Busbar systems and other emerging power applications.

These applications span a variety of industries including Electric Vehicles, e-Mobility, Charging Stations, Energy, Transportation, Industrial, Information & Communications Technology, and Medical & Life Sciences.

 


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