Molex introduces Latest iPass+ High-Speed Channel (HSC) CXP Copper and Optical Products

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15th April 2011

Source: Molex Incorporated

Molex introduces Latest iPass+ High-Speed Channel (HSC) CXP Copper and Optical Products

Molex Incorporated announces its latest additions to the iPass+™ product family. The iPass+ High-Speed Channel (HSC) CXP copper and optical system offers connectors and cables that achieve rates of up to 120 Gbps of pluggable data over 12 lanes in one assembly. This dual paddle-card system was adopted as the InfiniBand CXP 12x QDR standard, and by IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates.

Molex has employed the latest high data rate capable wafer technology and compliant-pin tails to develop two integrated connector offerings for the growing server-storage market:
• The enhanced footprint version is a high-density, 10-channel connector, which conforms to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface, and provides a path to future terabit networks.
• The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10 Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations.

“Not only does the iPass+ HSC CXP deliver one of the highest data rate capable I/Os on the market today, but it provides the most effective usage of space,” comments Larry Schultz, global product manager, Molex. “This allows our customers, the server and switch manufacturers, to provide twice as many high data rate capable channels as their current products and deliver a superior solution to the end-user.”