FCT Assembly Debuts RMA250 Solder Paste
7th October 2010
Source:
FCT Solder
FCT Assembly introduces its RMA250 Solder Paste, a new generation rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process.
RMA250 Solder Paste offers an excellent open time, extended abandon time and excellent soldering activity with all surface finishes. The paste is formulated for fast printing and meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes.
The pin probable paste features excellent print volume consistency with surface area ratios (SAR) as low as 0.55 when used with the UltraSlic™ stencil technology. RMA250 has a low voiding/high reliability composition and a wide reflow window with excellent solderability on various PCB surface finishes. Additionally, post-process residues are clear and can be removed with a saponifier.
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- FCT Assembly’s UltraSlic™ FG Stencil Wins a Global Technology Award for Second Consecutive Year 9th November 2010
- FCT Assembly Debuts NC676 No-Clean Leaded Solder Paste 8th November 2010
- FCT Assembly’s New Line of No-Clean Solder Pastes Reaches a New Level of Reliability 28th October 2010
- FCT Assembly Debuts RMA250 Solder Paste 7th October 2010
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