RMA250 Solder Paste offers an excellent open time, extended abandon time and excellent soldering activity with all surface finishes. The paste is formulated for fast printing and meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes.
The pin probable paste features excellent print volume consistency with surface area ratios (SAR) as low as 0.55 when used with the UltraSlic™ stencil technology. RMA250 has a low voiding/high reliability composition and a wide reflow window with excellent solderability on various PCB surface finishes. Additionally, post-process residues are clear and can be removed with a saponifier.