FCT Assembly’s UltraSlic™ FG Stencil Wins a Global Technology Award for Second Consecutive Year

9th November 2010
Source: FCT Solder
Posted By : ES Admin
FCT Assembly announces that it has been awarded a Global Technology Award in the category of Printing Equipment for its UltraSlic™ FG Stencil. The award was presented to Mike Scimeca, President & CEO, during a Tuesday, October 26, 2010 ceremony that took place during SMTA International at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. This is the second consecutive year that the UltraSlic™ FG Stencil received the Global Technology Award in the Printing Equipment category.
The UltraSlic™ FG stencil is the first laser-cut, solder paste stencil that has paste release performance comparable to electroform technology, yet can be cut and shipped the same day the order is placed. The UltraSlic™ FG stencil incorporates the latest advancements in stencil laser technology along with a new, cutting edge Fine Grain stencil material from Datum Alloys. Superior print performance is achieved at surface area ratios as low as 0.45.

UltraSlic™ FG stencils have lower standard deviations, higher repeatability and cleaner release of solder paste compared to other stencil technologies. A more consistent solder paste deposition, a reduction in stencil cleaning frequency, and minimized rework result in higher yields and tremendous throughput improvements.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

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