NC676 features best-in-class solder spread and wetting, print volume consistency down to 12 mm circles, and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. The no-clean paste leaves a colorless residue that is penetrable, maximizing pin testability.
The no-clean paste offers excellent resistance to hot and cold slump, resulting in minimal bridging and excellent wetting characteristics on all pad finishes. The use of NC676 results in clear, minimal residue, bright, shiny tin/lead solder joints and excellent solder spread on all common pad finishes.
NC676 provides excellent post-reflow yields and best in class after exposure to extreme humidity conditions. It also features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as excellent response to one-hour pause, after two knead strokes at 35-65 percent RH.