Techsil introduce IVS4742 encapsulant for low pressure LED on board lens moulding

In its continuous search for improved products that meet the latest customer and process requirements, Momentive Performance Materials has developed IVS4742, a self bonding LED encapsulant material with a viscosity and clarity that enables low pressure direct on-board lens moulding.

Direct on-board lens moulding is a major step forward in process simplification, since it combines the potting, lens moulding and mounting steps into a single process.

IVS4742 is a two component, addition cure silicone rubber specifically designed for optical device coating. It is an excellent candidate to consider for use in the direct on-board moulding process; its low viscosity can allow low pressure which helps minimize risk for LED damage. Its cure speed typically enables IVS4742 to be demoulded after 2 minutes at 150°C (further post-cure is required to assure completion of cure and adhesion to substrates). Naturally the mould itself needs to feature ease of demould properties (e.g. a Teflon layer).

Some of the key features of this silicone rubber include
- Excellent transparency
- Low viscosity allowing for good flowability
- Convenient 1:1 mix ratio by weight
- Cures fast with heat and adheres to parts: Excellent adhesion to PPA

IVS4742 is available from Momentive’s European distributor Techsil Ltd.