Dry film negative photoresist for MEMS
The introduction of the DF-3560 dry-film negative photoresist has been announced by Engineered Material Systems, for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.
DF-3560 is available in thickness formats from 5-100µm, five percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
The DF-3560 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 154°C (by DMA Tan Delta) and a moderate modulus of 3.25GPa at 25°C.
It is hydrophobic in nature, providing chemical and moisture resistance. DF-3560 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.
DF-3560 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for making microfluidic channels on MEMS devices and integrated circuits.
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