Engineered Materials Systems Inc (EMS)

The introduction of the DF-3560 dry-film negative photoresist has been announced by Engineered Material Systems, for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.

  The introduction of the EMS 618-15 adhesive has been annouced by Engineered Materials Systems. The room temperature cure, two-part, conductive adhesive has been designed for circuit assembly applications.