Sick Launches Next-generation Ultrasonic Fork Sensors

The versatility of the improved design is matched by a fast response time to ensure accuracy even at high web speeds, making it ideal for a wide range of packaging and labelling applications.

“The UF Next solves a host of problems encountered in labelling,” explains Phil Dyas, Sensor Expert SICK UK. “It will even detect double sheets, overlaps and two ply materials.”

“The ultrasonic technology overcomes the false signals picked up by optical sensors and this model is unaffected by temperature changes, so you really only need one sensor to cover all label types.”

The SICK UF Next fork sensor has a compact and rugged IP 65 aluminium housing, allowing it to be located in tight spaces and withstand difficult industrial conditions.

With a minimum detection space between labels of 2 mm and a stable response time of 250 µsec, the SICK UF Next is ideal for long run, high speed labelling operations. Quick set up is achieved via the dynamic teach-in, using either a control panel or remote wire, with manual fine tuning by the +/- buttons on the housing.