Sensor IC features a miniaturised form factor

17th February 2015
Source: ZMDI
Posted By : Siobhan O'Gorman
Sensor IC features a miniaturised form factor

 

An 18-bit Sensor Signal Conditioning (SSC) IC, which features an integrated 24-bit DSP for linearisation and calibration functions, has been released by ZMDI. The ZSSC3218 expands the company’s SSC IC family for high-end sensor modules.

Optimised for high-resolution industrial, consumer and medical applications, this sensor interface IC combines a 24-bit DSP, high accuracy amplification and 18-bit precision analogue-to-digital conversion with special features for battery-driven low-power devices, including 1mA typical overall current consumption, ultra-low 20nA typical sleep mode current and a 1.68-3.6V power supply range. The device features an intelligent power-save scheme to ensure lowest overall current consumption, internal filter options for low-noise output signals and intelligent alarm and interrupt features. The internal supply regulator with an outstanding PSRR eliminates the need for an external buffer capacitor, making the ZSSC3218 suitable for applications in harsh environments.

Digital compensation of signal offset, sensitivity, temperature and non-linearity is accomplished via an internal correction algorithm with coefficients stored on-chip in a highly reliable, non-volatile, multiple-time programmable memory. Programming is simple via the IC’s serial interface with the PC-controlled calibration software provided in ZMDI’s DevKit. The measured and corrected bridge values are provided at the digital output pins as I2C or SPI. The device can also provide a corrected temperature output measured with an internal sensor.

With an almost noise-free 18-bit output signal, the ZSSC3218 allows designs for high-precision measurement systems, including barometric altitude measurement for portable navigation or emergency call systems, altitude measurement for car navigation, pressure measurements inside hard disks and weather forecasting equipment. The IC can also adopt thermopile sensors to enable contactless temperature measurements of objects or human body temperature. Mobile products, such as phones or tablet computers, can greatly benefit from the device’s precision.

“Energy-efficiency is what we do best. We designed the ZSSC3218 to provide our customers with the miniaturised form factor required for their next-gen products,” said Michael Georgi, Product Marketing Manager, ZMDI. “The ZSSC3218 is designed for use with resistive pressure sensors as well as absolute voltage sensors such as thermopiles. Stacked die assembly together with a dedicated MEMS sensor element provide the lowest form factor for MEMS-based sensors in the market. A new application is contactless temperature measurement based on thermopile sensors in mobile devices.”

The ZSSC3218 is in full production and is available as die for wafer bonding. Die, samples and wafers are available from ZMDI. For 50,000 pieces, the ZSSC3218 is priced at $1.20 per unit.

Downloads


You must be logged in to comment

Write a comment

No comments




More from ZMDI

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

GISEC Global
23rd April 2024
United Arab Emirates Halls 2-8 - Dubai World Trade Centre
The Magnetics Show US
22nd May 2024
United States of America The Pasadena Convention Center
2024 World Battery & Energy Storage Industry Expo (WBE)
8th August 2024
China 1st and 2nd Floor, Area A, China Import and Export Fair Complex