Heat pipes transport heat away from hot components

Posted By : Siobhan O'Gorman
Heat pipes transport heat away from hot components

A series of copper heat pipes for transporting power dissipation away from hot electronic components, has been introduced by Advanced Thermal Solutions. These transfer component heat to heat sinks and distribute heat across the length of heat spreaders. 33 round and flat profile heat pipes are available for a range of applications.

Each model in the series has been designed for both thermal resistance and heat transport. Liquid in the heat pipe turns to vapour by absorbing heat and removing thermal energy from hot component surfaces. This vapour travels to the cold end of the pipe where it releases latent heat and condenses back to liquid. The liquid then returns to the hot interface along an internal copper wick to provide continuous thermal management.

The heat pipes provide cooling even when a heat sink cannot be applied directly onto a heat source, as the cold end attaches to many heat sinks. The pipes, which are hand or machine-shaped, can be friction fit, clamped, soldered or adhesively attached.

Each heat pipe consists of a sealed copper tube, internal copper wick structure, and distilled water as its working fluid. Round profile heat pipes are available in lengths from 200-300mm and diameters from 4.0-8.0mm. Flat profile heat pipes are available in lengths from 100-250mm, widths from 8.2-10.5mm, and heights from 2.5-4.5mm. Weights range from 8-33g. Both types operate in temperatures from 30-120°C. Other fluids and sizes are available on request.

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Silicone Expo Europe
28th February 2024
Netherlands RAI Amsterdam
GISEC Global
23rd April 2024
United Arab Emirates Dubai World Trade Centre
The Magnetics Show US
22nd May 2024
United States of America The Pasadena Convention Center
2024 World Battery & Energy Storage Industry Expo (WBE)
8th August 2024
China 1st and 2nd Floor, Area A, China Import and Export Fair Complex