Sealing and potting your electronics with ThreeBond - a new approach

Market leader ThreeBond have again addressed the needs of its electronics customers with their 2212B Single Part Epoxy Resin, especially formulated for low temperature and fast curing with minimal shrinkage, excellent electrical properties, excellent chemical resistance and high mechanical strength.

TB2212B can cure at temperatures as low as 80°C -30 min cure decreasing to 1 min cure at 150°C. The resulting benefits include usage on temperature critical components, energy savings, no mixing and simplified automation.

TB2212B has been developed for general bonding, sealing, potting and moulding. Its major applications include relay sealing, chip bonding, impregnation of small motor coils, component potting, as well as numerous other electronic component uses.

ThreeBond TB2212B consists of one-component epoxy resin, which is denatured to have all the excellent properties of epoxy resin such as strong adhesion strength, chemical resistance, electrical properties and mechanical strength. However, unlike two component compounds, TB2212B requires no weighing, mixing, stirring, de-foaming or other time consuming operations. Furthermore, automated dispensing equipment can further improve productivity. The solventless resin contains more than 99% non-volatile matter, so there is minimal shrinkage whilst curing and low out-gassing ensure a safe working environment. Availability is in 1kg, 4kg and 20kg.