New high temperature resistance polyimide adhesives from Intertronics

These polyimides are available as electrically conductive, thermally conductive and electrically highly insulating adhesives and coatings, optimised for dispensing, jet-dispensing and stamping techniques. They are also available as screen printable polyimides for the passivation of semiconductor surfaces.

Applications are to be found in the areas of semiconductors, photovoltaics, sensors, fibre optics and general electronics – where their high temperature resistance, electrical conductivity, thermal conductivity and protection against moisture have been found to be highly beneficial. Polytec EC P-690 has been qualified for high temperature die attach (1.4 mm chips) for operating temperatures up to 300°C in an application where evaluation has proved it to have the highest die shear strength of all the polyimide adhesives tested.

The Intertronics range consists of 4 specific products to suit varying demands of performance and processing – characteristics on which the engineers at Intertronics can advise in relation to customer-specific situations.