New generation of thermally conductive adhesives

These new high performance adhesives offer excellent thermal conductivity, so enhancing the effectiveness of heat paths found in applications such as LED heat sink attachment, chip assembly, encapsulation, potting of thermal sensors, assembly of power module, connection of pipes in heat exchangers and the bonding and potting of battery cells and electric motors. They can help optimise production processes with a choice of accelerated thermal cures in about 15mins or 24hrs at room temperature.

A good example is Polytec TC 433, an advanced semi-rigid boron nitride filled adhesive. It features 2W/mK thermal conductivity and a glass transition around 110°C after thermal curing, withstanding up to 220°C continuous operation temperature.