New positive displacement PC pump displayed at The ASSEMBLY Show
Exhibiting this year at The ASSEMBLY Show, Techcon Systems will be in Booth #345, from 25th-27th October, in Rosemont, IL. The team will demonstrate the new TS8100 Series Positive Displacement PC Pump, along with its dispensing robots. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.
The turning rotor on the TS8100 moves the fluid in tightly sealed cavities through the stator’s fluid chambers to create a volumetric fluid flow that does not change the shape or size of the fluid. Due to the PC pump’s unique dispensing technology, accuracy and repeatability of one percent is achievable.
The TS8100 comes standard with a syringe bracket, mounting bracket kit, luer lock fitting, cleaning kit and dispensing tip selection pack. Typical applications include: under filling PCBA components, encapsulation and potting applications, applying lubrication on automotive parts, and dispensing pastes and flux.
Techcon also will showcase its new TSR2000 Bench Top Robot Series that has been designed for a wide range of fluid dispensing applications, from inline to batch. The versatile TSR2000 dispensing platforms deliver consistent, high-performance dispensing results at an affordable price.
The TSR2000 Series is ideal for the following applications: dispense dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes.
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