New positive displacement PC pump at APEX 2017

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13th January 2017

Source: Techcon Systems

New positive displacement PC pump at APEX 2017

This year’s IPC APEX EXPO, scheduled to take place 14^th-16^th February at the San Diego Convention Center in California, will see Techcon Systems exhibiting in booth 1500. The Techcon team will demonstrate the new TS8100 Series Positive Displacement PC Pump with the TS500R-PC, along with its TSR2000 Bench Top Robot Series.

The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology. Due to the PC pump’s dispensing technology, accuracy and repeatability of one percent is achievable.

The turning rotor on the TS8100 moves the fluid in tightly sealed cavities through the stator’s fluid chambers to create a volumetric fluid flow that does not change the shape or size of the fluid.

The TS8100 comes standard with a syringe bracket, mounting bracket kit, luer lock fitting, cleaning kit and dispensing tip selection pack. Typical applications include: under filling PCBA components, encapsulation and potting applications, applying lubrication on automotive parts, and dispensing pastes and flux.

The TSR2000 Bench Top Robot Series has been designed for a wide range of fluid dispensing applications, from inline to batch. The versatile TSR2000 dispensing platforms deliver consistent, high-performance dispensing results at an affordable price.

The TSR2000 Series is ideal for the following applications: dispense dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes.

Additionally, Techcon will demonstrate the TS9200D Jet Valve, TS5624DMP, TS5000DMP Rotary Microvalve, TS500R Multi-purpose digital controller, its syringe and cartridge display, and the TS350 Digital Dispenser

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