Molex to demonstrate defence industry expertise at DSEi 2011 - Connectivity solutions that give systems a tactical advantage

“From land to air to sea, your military designs will perform better and last longer with Molex technology,” says Stephen Webster, European industry specialist, military & aerospace at Molex. “By employing our expertise as a leading interconnect company, we’ve developed an array of advanced interconnect solutions that ensure seamless connectivity in mission-critical applications – from integrated command communications to platform systems. We have experienced engineers around the world that understand the demands of the defence industry, with its rugged environments and demanding standards.”

Among the many products at that stand will be the EXTreme Power™ family of high-current interconnect solutions with power ranges from 16.0A blades to 150.0A modules. Designed specifically for space-constrained applications, this family offers best-in-class power densities whilst maintaining excellent thermal management properties.

An array of backplane interconnect solutions will be on show that deliver on the industry’s need for increased network bandwidth in mission-critical systems, while maximising signal integrity and providing mechanical reliability. Meeting the VITA 57 FPGA Mezzanine Connector (FMC) standard, SEARAY* High-Speed Board-to-Board products, which are designed with Molex’s patented Solder Charge™ SMT technology, provide best-in-class process yields and support a mixed-digital and analogue format.

Targeting radar and radio systems Molex offers a complete range of radio frequency solutions and connectors with extensive capabilities for high- and low-volume assemblies covering frequencies up to 50 GHz. A wide range of coaxial cable options and interfaces is available in accordance with MIL-C17, MIL-PRF-39012 and MIL-STD-348 specifications, with sealed coaxial designs that meet IP68 in the unmated condition.

Ideal for tight packaging applications, the SlimStack™ family of stacking connectors offers the widest selection of low-profile interconnect systems in the industry. The double wall strength design offers resistance to shock and vibration, maintaining long-term mating reliability and secure mating retention in the field.

And completing the extensive range of products, Molex specialises in providing connector assemblies for a wide variety of applications, including advanced fibre optics, switches and PCBs. With extensive expertise in flex circuit design and assembly, and a broad product offering Molex CopperFlex products provide total, optimal solutions for packaging challenges – from high-speed signals to power requirements. Optimised designs provide unmatched mechanical performance and flexibility in weight and space constrained applications, such as helmet systems.

With versatile design and manufacturing capabilities, Molex offers industry-standard cable assembly solutions that enable compatibility and support next-generation speeds. In addition, hybrid cable solutions are available for interconnection with legacy interface standards, such as MIL-38999 and MIL-26482, where Molex connector offerings help meet the newest standards of higher speed computing and storage systems. Common applications include technology upgrades to radar systems, tactical mission computers and C4ISR situational awareness systems.

From ruggedised assemblies and backplanes to optical FlexPlane™ circuitry and adapters, the Molex Fibre Optic line-up is both varied and comprehensive; the all-optical version of its popular Mil-DTL-38999 Series III connector system uses Molex LumaCore™ optical terminus technology to deliver dense optical connections with stable optical performance in harsh environments

During this year’s DSEi, visitors to the Molex stand (S8-283) will have the opportunity to see first hand this impressive display of leading-edge products as well as speak to Molex engineers about their project needs.

Exhibition details:
Molex
Stand S8-283
Defence Systems & Equipment International (DSEi) 2011
ExCeL, London
13th – 16th September, 2011