Multitest’s board division has successfully introduced a new LCR (layer count reduction) concept for high pin count BGA applications. Board customers now will benefit from significant cost savings without sacrificing performance. With the new LCR concept, the layer count of standard pitch BGA boards can be reduced by up to 40 percent.
Board thickness often is a mechanical issue in terms of docking height and/or connector requirements. Other approaches used to slim down boards, such as using thinner cores, are limited due to manufacturability and performance.
With the company’s design-to-delivery PCB services, Multitest leverages the unique capabilities of its board fabrication site and the extraordinary expertise of its design team. DFM (design for manufacturability) guidelines have been developed, allowing board designers to reduce both the signal layers and the necessary ground planes.
The design rules for LCR have been characterized by Multitest’s signal integrity team to ensure performance: the diameter of the antipads, vias and tracing geometries are proven to have no negative impact on PCB performance.
To learn more about the advantages of Multitest’s board services, visit www.multitest.com/boards.