Christopher Associates Introduces New SPC Software Package for Solder Paste Inspection

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10th June 2010

Source: Christopher Associates, Inc

Christopher Associates Inc. introduced a powerful new yield improvement tool for the solder paste printing process. SPC+ Software, developed by Koh Young Technology, is a high-functionality statistical process control (SPC) package that can be run on the system or offline. The new software is included free of charge on all new Koh Young equipment.

The software offers the ability to analyze both images and data to track performance, improve manufacturing yields and provide complete traceability under real-time conditions. Defect review, X Bars & S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated quickly and accurately with Pareto charts and the ability to drill down on specific data points.

The real-time capabilities of SPC+ allow for immediate operator adjustment of solder paste printing parameters to achieve optimum print quality and eliminate defects before they occur, dramatically reducing repair costs.

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