FCT Assembly Promotes Robert Dervaes to VP of Technology for Its Solder Division

17th June 2010
Source: FCT Solder
Posted By : ES Admin
FCT Assembly Promotes Robert Dervaes to VP of Technology for Its Solder Division
FCT Assembly announces the promotion of Robert Dervaes to VP of Technology and Engineering for its Solder division, FCT Solder. Robert has spent the past 12 years working as the VP of Technology and Engineering for Fine Line Stencil, a division of FCT Assembly.

As VP of Technology and Engineering for the Solder division, Dervaes will direct technical development and engineering for both Fine Line Stencil and FCT Solder. With his strong engineering background in both the defense and commercial electronics industries, Robert is a major contributor to establishing Fine Line Stencil as a technological and quality leader in the stencil industry.

“Robert is a key member of our technology team and has done a tremendous job establishing Fine Line Stencil as a technology leader in the stencil industry. With the technical demands of the electronics assembly industry increasing rapidly, our customers need products and solutions for the technology of today as well as that of tomorrow. Promoting Robert to the VP of FCT Solder and Fine Line Stencil is another step in our commitment to do just that,” said Mike Scimeca, President and CEO.

Robert Dervaes has more than 19 years of progressively responsible experience directing the design and manufacturing operations for several multimillion dollar electronics companies. He is a member of the IPC Stencil Design Task Group and has published a white paper entitled “Conquering SMT Stencil Printing Challenges with Today’s Miniature Components.” Robert holds a Bachelor’s degree in Mechanical Engineering from Kansas State University.

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