Let Kyzen Save You 50% on Stencil Cleaning Solutions at NEPCON South China 2010

4th August 2010
Posted By : ES Admin

Kyzen, will showcase its award-winning stencil cleaning solutions LONOX® L5608 and LONOX® L5611 in booth 2F10 at the upcoming NEPCON South China 2010 exhibition and conference. The event is scheduled to take place August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.

LONOX® L5608 and LONOX® L5611 are cost-effective replacement solutions for users’ current stencil wash chemistries and can save an average of 50 percent over users’ current process.
LONOX® L5608 is a low-COD aqueous cleaning solution designed to meet the challenges presented by the latest solder paste and flux formulations while meeting RoHS and environmental constraints. L5608 has proven very effective to remove RMA, OA and No-Clean solder pastes at low concentrations in stencil, misprint and pallet cleaning applications. Lonox L5608 can be used in batch, in-line or immersion systems with minimal environmental impact and low cost of ownership. Bath life studies for LONOX® L5608 show high loading capacity. This equates to long tank life, low maintenance costs, reduced waste generation and chemical consumption, which all translate into significant cost benefits.

LONOX® L5611 is an aqueous blend cleaning chemistry designed for optimum effectiveness on removing flux, solder paste and uncured adhesives from stencils and misprints. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature to provide an economical cleaning solution. LONOX® L5611 is compatible with most standard stencil cleaning equipment and can be used in immersion, spray-in-air as well as ultrasonic systems. LONOX® L5611 is a biodegradable low VOC aqueous solution. It contains no CFC’s or HAP’s.

LONOX® L5608 and LONOX® L5611 are RoHS compliant, Halogen, Halide and Hexane free. These formulations have proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. Additionally, the Kyzen Applications Laboratory has evaluated all these formulations for effective removal of nearly 300 soldering materials from the world’s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.


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