Kyzen to Display MICRONOX® MX2302 Wafer-level Cleaning Solution at SEMICON West 2010
Kyzen, will display its MICRONOX® MX2302 Wafer-level Cleaning Solution in booth 6356 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.
MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.
MICRONOX® MX2302 is available in one, five, and 55 gallon containers.
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