Versarien’s Low Profile Heatsinks Gain Prestigious Industry Award

These highly respected and influential awards acknowledge revolutionary products that are capable of transforming electronics design. The magazine’s editorial team assessed thousands of entries, covering all aspects of the global electronics business. 12 different companies received awards and Versarien was unique in being the only British company to be a recipient.

Versarien’s LPH00xx series of low-profile heatsinks are targeted at passive cooling within space constrained environments. These products are based on the proprietary VersarienCu™ microporous copper foam material. The structure of this material, which consists of a homogenous distribution of tiny interconnected pores, presents a very large surface area through which superior heat dissipation capabilities can be derived. The heatsinks provide a compact and cost-effective way to efficiently cool modern high density electronic systems where ICs are packed closely together.

"This award shows that Versarien has the ability to take game-changing material technology and apply it to commercially viable products offering major operational benefits to the electronics engineering community," states Neill Ricketts, CEO and Founder of Versarien. "The combination of limited space and higher component counts have serious implications for thermal management. The LPH00xx series is helping to bring things back in engineers’ favour.”