Highlighting a full line of market leading selective soldering and wave soldering systems, SEHO North America, will be in booth 2309 at the IPC APEX EXPO, taking place February 14th – 16th at the San Diego Convention Center.
Electronics production faces new manufacturing challenges more and more frequently. Besides high quality requirements at low production costs, there also are an increasing number of product variants and the need for flexible reactions to fluctuation in demand. SEHO soldering systems offer the optimal solution when both matters, high soldering quality and outstanding flexibility.
The selective soldering system GoSelective-LS is particularly designed for stand-alone production of small and medium sized volumes and it scores highly with its very compact design. To ensure an ergonomically work flow and the shortest cycle times, the GoSelective-LS is equipped with a loading and unloading station for carriers up to 20x20”.
Here, boards can be assembled in one carrier while a second carrier is being processed in the machine. All process steps are completely automated. The machine features a precise axis system that reliably positions the drop jet fluxer; preheat unit and soldering unit during the process. Depending on the requirements, the electro-magnetic soldering unit may be used for flexible mini-wave soldering processes, or can be equipped with a multi-nozzle tool for dip soldering with short cycle times.
SEHO also will showcase the selective soldering system SelectLine-C that features a modular design and innovative technical details, thus ensuring clear cost benefits. The SelectLine-C machine concept incorporates fluxer station, various preheat stations and several soldering stations that may be equipped to meet different manufacturing requirements.
A particular highlight for the soldering area is the Synchro software feature to double production volume without major investments. In addition, a brush station to remove any residues after the soldering process and an AOI station for immediate inspection of solder joints can be integrated into the machine. The different machine modules can be configured to an individual manufacturing line and, of course, the machine can be upgraded with additional modules at any later date as well to grow with the production requirements.
All of SEHO’s selective soldering systems feature 100% process controls, with fiducial recognition, flux quantity control, wave height control, process visualisation, mcServer and many more value-added features. In doing so, they provide uncompromising superior accuracy and soldering quality. Outstanding is SEHO’s automatic ultrasonic nozzle cleaning function that guarantees reliable processes and maximum machine availability.
SEHO also will introduce new and innovative concepts in the field of wave soldering. As an alternative to the conventional solvent-based fluxing process SEHO developed a new plasma process to deposit flux powder at the printed circuit board surface. Due to reduced residues, product quality and downtime of the machine can be improved, thus ensuring remarkable cost reduction.
Preheating of PCBs, especially for the increasing share of power electronics, requires a high energy density. This can be implemented efficiently by using new infrared emitters that offer extremely good heat transfer. The fast response of these emitters, an exact PCB monitoring system and newly developed software allow that the emitters are only activated in areas where a PCB is located.