Innovation Day For USB 3.0 and CMOS Sensor Technologies
11th June 2012
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STEMMER IMAGING
Recognising the high level of interest in ‘SuperSpeed’ USB 3.0 camera technology for machine vision, STEMMER IMAGING is hosting the ‘IDS Innovation Day’, in conjunction with IDS, manufacturers of the uEye CP range of USB 3.0 cameras with CMOS sensors.
This lively and informative event is free to attend and will be held at the Ramada Hotel, Farnham, UK on 3rd July 2012. It will include presentations from several different companies, live demonstrations and real-world case studies.
Experts from IDS Imaging Development Systems GmbH, STEMMER IMAGING UK, e2v technologies plc and CMOSIS nv will be available throughout the day to answer individual questions, both about applications of the USB 3.0 interface and the latest trends in CMOS sensor technologies.
The new USB 3.0 interface offers high-speed data transfer rates of 400 MByte/s, making the cameras ideally suited to a wide range of data rich applications. This is a tenfold increase in data transfer rate compared to USB 2.0 and around 4 times the speed of the GigE interface. Data transmission distances of more than 10 metres can be achieved using standard industrial cables. USB 3.0 is also downward compatible and so can be used in existing USB 2.0 systems.
Experts from IDS Imaging Development Systems GmbH, STEMMER IMAGING UK, e2v technologies plc and CMOSIS nv will be available throughout the day to answer individual questions, both about applications of the USB 3.0 interface and the latest trends in CMOS sensor technologies.
The new USB 3.0 interface offers high-speed data transfer rates of 400 MByte/s, making the cameras ideally suited to a wide range of data rich applications. This is a tenfold increase in data transfer rate compared to USB 2.0 and around 4 times the speed of the GigE interface. Data transmission distances of more than 10 metres can be achieved using standard industrial cables. USB 3.0 is also downward compatible and so can be used in existing USB 2.0 systems.
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