ECT’s CPG To Showcase The Zip™ Family At International Test Conference In Austin, Texas

ECT’s Contact Products Group’s display will highlight its expanded line of available pitches from 0.8mm down to 0.2mm center spacing. ECT also will feature the high-performance Bantam®, the pin of choice for the most demanding test applications; the Mini-Mite™, for higher current and consistent C-res requirements; and the CSP series, for a wide variety of double-ended Pogo technology applications with drop-in compatibility for many competitor test probes. ECT CPG personnel will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its new range of products, which includes:

ZIP SCRUB™ ― The ZIP SCRUB pin features a positive “scrub-action” pad and ball contact on lead-free plated array and peripheral devices where solder transfer causes frequent cleaning and maintenance cycles.

ZIP KELVIN ― ECT’s ZIP KELVIN is ideal for voltage sensitive device tests on array or peripheral devices requiring sub-1 ohm resistance measurements typical in RDSON and high-power applications.

ZIP SUPER SHORT ― The SUPER SHORT is designed for 0.5nH low impedance, high frequency testing.

ZIP LongTravel ― The ZIP LongTravel, with an OAL up to 6.7mm, was developed for contacting large devices and strip tests where planarity and compliance are an issue.

Z8 ―The Z8 is suited for burn-in applications and combines the performance features of the standard ZIP in a “burn-in-price-point” replaceable compliant pin.

The ZIP patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP Series is designed to meet today’s demanding test requirements and economics.