CyberOptics to Unveil Latest Inspection Equipment at APEX 2010

The CyberOptics brand has become synonymous with combining quality and accuracy with speed. Visitors at the show will be the first to discover the technology innovations behind the company’s latest inspection equipment ― unique image acquisition automatic optical inspection (AOI) and zero machine-to-machine variation 3-D solder paste inspection (SPI) systems.

CyberOptics will display the industry recognized, award winning SE500™100 percent 3-D solder paste inspection system at the show. This system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed without compromise to measurement accuracy and repeatability.

Building on CyberOptics’ reputation as the leading provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 x 50 mm (2 x 2 in.) up to 510 x 510 mm (20 x 20 in.) The SE500X can transport panels from 100 x 100 mm (4 x 4 in.) up to 810 x 610 mm (32 x 24 in.).

The team at CyberOptics looks forward to welcoming visitors to booth 2271 during the three-day event.