CyberOptics to Exhibit Latest Inspection Equipment at JISSO PROTEC 2010

CyberOptics Corporation , announces that it will highlight its QX500™, SE350™ and SE500™ in booth 3D-03 at the upcoming JISSO PROTEC exhibition, which is scheduled to take place June 2-4, 2010 at the Tokyo Big Sight in Japan.

The QX500™ will be highlighted on the show floor with back-to-back demos. The AOI system represents a quantum leap in inspection technology, system design and speed, and improved cycle times. The QX500™ combines a unique image acquisition solution to provide highest-speed inspection at 100 cm²/sec. The introduction of SIM modules in QX500™ offers “on-the-fly” AOI inspection combined together with CyberOptics’ patented image processing technique, SAM. This dual advantage undoubtedly sets it apart from the conventional inspection methods.

The QX500™ uses white strobed lighting that consists of dual fixed angle lighting providing a superb image for defect review. Users can further enhance component features by choosing a combination of lightings. QX500™ is designed to provide the ideal platform that can be integrated in assembly lines which manufacture memory modules, notebook PCs, mobile phones, automotive products, and other industrial electronic assemblies.

SE350™ is the latest addition to CyberOptics’ 3-D solder paste inspection system portfolio. The simple and robust SE350 design with CyberOptics calibration-free sensor technology offers the lowest cost of ownership in the industry with zero machine-to-machine variation across the production lines. Leveraging on the technology of SE500, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm).

CyberOptics also will display the industry recognized, award winning SE500™100 percent 3-D solder paste inspection system at the show. This system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed without compromise to measurement accuracy and repeatability.
Building on CyberOptics’ reputation as the leading provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.