Events News

Seika Machinery, Inc announces that it will offer special show pricing for orders received for its McDry Electronic Drying Storage Case, MCU-201 model, and Sayaka CT23Q Table Top Router during SMTA International.

At Embedded Live (Earls Court, London, 20-21 October 2010), Arrow Electronics will showcase the latest technology available through its Arrow Embedded Solutions (AES) team. Alongside Arrow’s technical specialists will be product experts from manufacturers including Microsoft, Sharp, Intel, Freescale, Traco, Telit, Digital View and Advantech.

Nihon Superior Co. Ltd announces that Keith Sweatman will present a paper titled “The Development of an Improved Tin-Zinc Solder” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will be held during Session MFX2, titled “Alternate Lead-Free Alloys: Materials and Processes,” which will take place Tuesday, October 26, 2010 from 2-3:30 p.m. in room Oceanic 3.

Christopher Associates will display a comprehensive portfolio of exciting new technologies in booth #214 at the upcoming SMTA International, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Juki Corporation will showcase its latest assembly system in booth 641 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Seika Machinery, Inc will feature its advanced machinery at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place Thursday, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will be held during Session HE3, titled “Organic Materials Adapted for Harsh Environments,” which will take place Monday, October 25, 2010 from 1-2:30 p.m. in Oceanic 7. Co-authors include Mike Moreau, Martin Gershenson, Cathy He, Yinbai Li and Miaosheng Zheng.

The International PV Equipment Association announces that it jointly organized the PV Production Forum 2010, with the European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC). The forum attracted 250 participants in its three sessions about PV markets, silicon and thin film production today.

Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will be held during Session AAT1, titled “Package on Package Assembly Optimization,” which will take place Tuesday, October 26, 2010 from 10:30 a.m.-12:30 p.m. in Asia 1. Co-authors include Manabu Itoh, Gordon Clark, Masatoshi Fuji, Hajime Takahashi and Roberto Garcia

VJ Technologies, Inc announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will take place during the Session titled “Pad Site Dress Methods,” which will take place Wednesday, October 27 from 12-12:30 p.m.