3D Collaboration & Interoperability Conference Draws Record Attendance

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16th May 2008

Longview Advisors, organizers of the 2008 3D Collaboration & Interoperability Conference and Exhibition, reported record attendance to its fourth annual event, which commenced today in Denver, Colorado. The conference attracted more than 138 experts and executive decision makers from automotive, aerospace, machinery, electronics and other discrete manufacturing industries, along with representatives from government and the defense community, to discuss the topic of the exchange of 3D data. Attendees will take part in a diverse choice of breakout sessions, lively panel debates, and direct interaction with leading experts in the field.

“This year’s gathering was in many ways a perfect storm,” said David Prawel, President of Longview Advisors. “Even in a period of an economic slowdown, we had a huge amount of interest in the advancement of high-tech interoperability, with a record-setting number of attendees from all over the world. The success is due in part to the great assembly of engaging speakers this year and also an increasing recognition through many sectors of industry that dealing with the interoperability problem is extremely critical for the future of competitiveness.”

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