High-speed automated systems from PI can speed up wafer-level testing and assembly tasks for SiP and Optics applications. A new catalogue on fast automated alignment solutions for silicon photonics and optical components will be available from PI, just in time for this year’s SPIE Photonics West conference.
The catalogue highlights award-winning multi-axis, parallel alignment systems for industrial requirements where speed is critical and accuracy needs to be at the nanoscale – including wafer-level testing and component packaging.
The SiP solution
The FMPA Fast Multichannel Photonics Alignment Engine is the fastest alignment system currently on the market. Based on parallel execution of mechanical and optical processes, time savings on the order of 90% and more are feasible compared to traditional photonics alignment systems. The systems are available for single and double sided alignments and can also be added to existing wafer probers.
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