Substrate coupling analysis solution addresses parasitic effects

Posted By : Alex Lynn
Substrate coupling analysis solution addresses parasitic effects

Unwanted substrate couplings can impact modern IC developments, causing parasitic effects that are damaging to overall performance. Engineers have to deal with this by taking a slow and laborious ‘trial and error’ approach, which calls for the allocation of many hours of experienced engineers’ time while numerous different design iterations are made and then experimented with.

Continuing to drive innovation in analog/mixed-signal IC fabrication, X-FAB Silicon Foundries SE has announced the introduction of SubstrateXtractor.

The objective of SubstrateXtractor is to change all that. Created in partnership with Swiss EDA software vendor PN Solutions, and based on its innovative PNAware product, this is the semiconductor industry’s first commercially available tool dedicated to addressing the simulation of large signal substrate parasitic effects.

Working in conjunction with X-FAB’s established simulation libraries, it allows engineers to investigate where potential substrate coupling issues could occur and make the changes necessary to eliminate them (via better floor planning, guard rings, etc) before the initial tape-out has even begun.

Through it, engineers will gain full visibility of all the active and passive elements within the substrate and be able to experiment with different simulations in order to find a design concept that delivers maximum substrate coupling immunity within the project’s particular parametric constraints.

Furthermore, they are able to determine the minimum number of substrate contacts and guard rings needed for a project, no matter how complex and sophisticated it is – thereby resulting in more effective utilisation of the available area.

“By employing the SubstrateXtractor tool, layout engineers will be able to uncover any adverse substrate effects early on in the development cycle and subsequently mitigate them,” explained Joerg Doblaski, Director of Design Support at X-FAB. “This will make IC implementation procedures far more streamlined and quicker to complete, avoiding the need to rework designs to increase levels of optimisation, and resulting in significant cost savings.”

SubstrateXtractor is set to dramatically reduce the number of design iterations required, leading to much lower engineering overheads. This results in a faster time to market making a first-time-right analog design possible.

From now onwards this functionality will be integrated into X-FAB’s process design kit (PDK) and available for use with the company’s popular XH018 high voltage 0.18µm mixed-signal CMOS offering. A version for the power management process XP018 will soon follow. A detailed webinar on this valuable new tool will be hosted on May 22nd and 23rd.

Downloads


You must be logged in to comment

Write a comment

No comments




More from X-FAB Semiconductor Foundries AG

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

GISEC Global
23rd April 2024
United Arab Emirates Halls 2-8 - Dubai World Trade Centre
The Magnetics Show US
22nd May 2024
United States of America The Pasadena Convention Center
2024 World Battery & Energy Storage Industry Expo (WBE)
8th August 2024
China 1st and 2nd Floor, Area A, China Import and Export Fair Complex