Magma's FineSim Deployed by Toshiba Corporation for Advanced Flash Memory Sign-off Simulation

30th November 2010
Source: Magma
Posted By : ES Admin
Magma® Design Automation Inc. a provider of chip design software, announced today that Toshiba Corporation, a leading provider of flash memory products, has deployed the FineSim™ platform for sign-off simulation. Toshiba uses FineSim Pro with the native multi-CPU technology for its NAND flash memory development.
“Toshiba’s flash products, featuring leading-edge technology and functionality, are highly differentiated and used in wide variety of applications,” said Masaki Momodomi, Memory Technology Executive of Toshiba Corporation's Semiconductor Company. “This makes it imperative that we are first to market with highly reliable products. Magma’s unified circuit simulation platform increases our overall design productivity by allowing us to make intelligent tradeoffs between performance and accuracy within a single tool.”

“Toshiba’s decision to use FineSim as its primary circuit simulation solution demonstrates the value of Magma’s unified multi-CPU simulation platform,” said Anirudh Devgan, general manager of Magma’s Custom Design Business Unit. “With the performance improvement provided by FineSim leading semiconductor providers such as Toshiba can reduce design and manufacturing costs while meeting critical time-to-market goals.”

FineSim SPICE: Simulating Advanced Circuits
FineSim SPICE is a SPICE-level simulation analysis tool that incorporates transistor-level simulation analysis capabilities for mixed-digital and analog designs. In addition, FineSim SPICE supports distributed processing over multiple CPUs or machines, enabling simulation of large-scale mixed-signal designs. By providing increased speed and capacity while maintaining full-SPICE accuracy, FineSim SPICE enables designers to simulate advanced circuits – such as PLLs, ADCs (analog-to-digital converters), DACs (digital-to-analog converters) and gigahertz SERDES (SERializers/DESerializers) – that they previously would not even attempt using slower traditional SPICE simulators.

FineSim Pro: First to Offer Multi-CPU Support
FineSim Pro is the industry's first fast SPICE circuit simulator that supports multi-CPU simulations. It is the only simulator that performs true multi-CPU SPICE analysis. This allows for the most accurate results with the best possible throughput. FineSim Pro verifies a range of designs from large memories to large complex analog ICs, which previously could not be practically verified in transient circuit simulators. FineSim Pro also has a separate option for IR drop and electromigration analysis.




You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

The Magnetics Show US
22nd May 2024
United States of America The Pasadena Convention Center
2024 World Battery & Energy Storage Industry Expo (WBE)
8th August 2024
China 1st and 2nd Floor, Area A, China Import and Export Fair Complex