Christopher Associates’ Jasbir Bath to Chair Head-in-Pillow Technical Session at SMTAI 2010

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5th October 2010

Source: Christopher Associates, Inc

Christopher Associates’ Jasbir Bath to Chair Head-in-Pillow Technical Session at SMTAI 2010

Christopher Associates/Koki Solder announce that Jasbir Bath, Consulting Engineer, will Chair Session MFX5, titled “Head-in-Pillow Component Soldering Defects” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in Oceanic 3.

Head-in-Pillow component soldering defects are a growing problem in the industry and are typically related to component and/or board warpage. There are increasing developments of solder paste to help mitigate the effect. The session will discuss the test methodologies to create and quantify Head-in-Pillow defects as well as potential material/process solutions to minimize them.

Results will be discussed on the redesign of components to control warpage during reflow. Information on developing iNEMI projects on qualification requirements and primary factors affecting component warpage during reflow will be presented in relation to the JEDEC standard.

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