One chip solution for accurately monitoring headlamp output

30th June 2016
Source: Melexis
Posted By : Daisy Stapley-Bunten
One chip solution for accurately monitoring headlamp output

In response to the emergence of laser-powered automotive front lighting systems, Melexis has optimised its MLX75305 series of advanced light sensor ICs. Each MLX75305 incorporates a photodiode, trans-impedance amplifier and output stage. Unlike competing devices on the market, it is fully AEC-Q100 qualified and supports an operational temperature range from -40C up to +125°C.

Supplied in a compact SOIC8 package, the MLX75305 provides engineers with a simple to implement, one chip solution for accurately monitoring headlamp output, requiring minimal external components and taking up very little board space. Covering a spectral bandwidth of 500- 1000nm, the IC maintains ±2% linearity across its whole output voltage range with a typical responsiveness of 70mV/(uW/cm2).

Front lighting based on laser diodes is destined to see deployment within a growing number of high end vehicles in the near future. By using this technology substantial increases in illumination can be witnessed, thus enabling long-range sight, while at the same time lowering the power budget required. Laser-powered front lighting provides a way for car manufacturers to improve safety for road users without affecting vehicle fuel efficiency. The increased luminous flux also means that headlamps can be reduced in size - thereby enhancing the vehicle’s aesthetic and its aerodynamic properties. 

“The MLX75305 can address the challenging demands of next-gen laser front lighting applications, providing a highly cost effective and streamlined output monitoring solution that is able to cope with harsh automotive environments - where exposure to extreme heat and electro-static discharges are commonplace,” states Gualtiero Bagnuoli, Marketing Manager for Optical Sensors at Melexis. “Our engineering teams are now working with the foremost automobile brands, and their system integration partners, to develop monitoring systems that feature this IC.”

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Industry 4.0 Summit 2018
28th February 2018
United Kingdom Manchester
MACH 2018
9th April 2018
United Kingdom NEC, Birmingham