Mirtec To Premier Its Complete Line Of Technologically Advanced Automated Optical Inspection Systems At Apex 2010

MIRTEC will feature an MV-7xi configured with the new ISIS Vision System at booth #2219 at the upcoming APEX exhibition & conference scheduled to take place April 6-9, 2010 in Las Vegas. All attendees are invited to visit with MIRTEC for a first hand demonstration of this new technology.

At the show, MIRTEC will be exhibiting the latest in their award winning MV-7 Series; the MV-7xi In-Line AOI System. Fully configured, this system provides one top down view Five Mega Pixel camera, with a Precision 9.8 Micron Telecentric Compound Lens and four Five Mega Pixel Side-View Cameras. The patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi at APEX will feature a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. This system will also be configured with MIRTEC’s exclusive Intelli-Scan Laser System. This system provides the “Third Dimension” in inspection capability - the ability to precisely measure the Z-height of a given region of interest. This advanced technology offers; superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The system is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.

The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted Five Camera Desktop AOI system. New to APEX 2010, MIRTEC will be displaying an MV-3L configured with a Top-Down View Five Mega Pixel camera, with a Precision 9.8 Micron Telecentric Compound Lens and four Five Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices, as well as enhanced solder paste measurement capability.




The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCB’s post screen print. This technology is far superior to laser SPI technology. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 is configured with an ultra high resolution Four Mega Pixel Telecentric Camera System for enhanced image quality and superior accuracy. The MS-11 uses the same robust platform as MIRTEC’s MV-7 Series. Inspection heads are interchangeable between the two systems adding ultimate flexibility to the inspection process.

Visitors will be able to find out more about MIRTEC’s total quality management system software, Intellisys, This software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and monitoring of up to eight production lines allowing MIRTEC customers to further maximize the efficiency of their inspection process. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.

“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment”, continued D’Amico, “APEX has always been the perfect forum to display new and innovative technology. With this in mind, we at MIRTEC chose APEX to unveil our most technologically advanced AOI and SPI products to the Electronics Manufacturing Industry. We look forward to welcoming visitors to our booth #2219 during the three day event.”