CyberOptics Features Award Winning SPI and AOI Systems at Nepcon Korea

11th March 2010
Posted By : ES Admin
CyberOptics Features Award Winning SPI and AOI Systems at Nepcon Korea
CyberOptics Corporation announces that it will feature its award winning inspection systems at Nepcon Korea, scheduled to take place March 31- April 2 at COEX in Seoul. The SE500™100 percent 3-D solder paste inspection system and Flex HR™ High-Resolution automated optical inspection system will be shown on booth E127.
Building on CyberOptics’ reputation as the leading provider of solder paste inspection systems with industry-leading volume accuracy, the well received SE500™ has the ability to inspect the most demanding assemblies at >80 cm²/second inspection speed without compromise to measurement accuracy and repeatability. The SE500™ systems can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

The enhanced resolution AOI system, Flex HR™, is one of the highest-speed inspection systems in the industry and is ideally suited for assembly lines producing memory modules, notebook PCs, mobile phones, automotive products and other industrial electronic assemblies. With an inspection performance for 01005 components and larger, Flex HR™ inspects the most comprehensive list of features, detecting the widest variety of defect types as well as unanticipated defects.

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