STI Electronics to Highlight Key Engineering Services at the 2010 Defense Manufacturing Conference

STI’s Engineering Services division will highlight its patented packaging technology coined Imbedded Component/Die Technology (IC/DT®), custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the Microelectronics Lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM).

The Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of small to medium volume electronics manufacturing as well as microelectronics and hybrid assemblies in a certified class 1000 cleanroom.

STI also specializes in military contract electronic assemblies and failure analysis. From product design and manufacturability analysis to pre-production prototype and development, STI’s Engineering Services division is equipped to support its customers.

For more information about STI’s Engineering Services division, stop by Booth 119 at the show or visit www.stielectronicsinc.com.