STI Electronics’ Mark McMeen to Hold IC/DT Presentation at SMTA Tampa Chapter Industry Expo

Military and aerospace electronics providers continue to push the technological envelope to design and manufacture leading-edge electronics for today's users. Current design problems are not driven by circuit design capabilities, but by an inability to reliably package these circuits within space constraints. Innovative packaging techniques are required in order to meet the increasing size, weight, power and reliability requirements of this industry without sacrificing electrical, mechanical or thermal performance.

Emerging technologies such as those imbedding components within organic substrates have proven capable of meeting and exceeding these design objectives. IC/DT® addresses these design challenges through imbedding both active and passives into cavities within a multilayer printed circuit board (PCB) to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly.

This presentation discusses the design methodology, packaging processes and test data gathered during the implementation of IC/DT® in a mixed-signal prototype. The prototype designed and assembled using IC/DT® processes was subjected to reliability testing and ultimately demonstrated in a test flight. The results from this testing will be presented.

Mark T. McMeen joined STI Electronics Inc. as Vice President of Engineering Services in July 2000. Prior to STI, Mr. McMeen was the Vice President of Engineering and Technical Director of Component Intertechnologies, Inc. He currently oversees the daily operations of the Engineering Services division of STI. He has more than 20 years experience in the manufacturing and engineering of PCBs, both flexible and rigid, as well as in the manufacture of electronics assemblies. Mr. McMeen holds a Bachelor of Science degree from the University of Montevallo in Corporate Finance and a minor in Cost Accounting.