See STI Electronics’ Engineering Services Division at Lockheed Martin LM Connect 2010

STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the Microelectronics Lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).

The Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of small to medium volume electronics manufacturing as well as microelectronics and hybrid assemblies in a certified class 1000 cleanroom. STI also specializes in military contract electronics assemblies and failure analysis. From product design and manufacturability analysis to pre-production prototype and development, STI’s Engineering Services division is equipped to support its customers.