KIC’s Brian O’Leary to Present during IPC’s Summer School Series of Webinars

O’Leary’s Webinar, Non-Destructive Profiling Methods, will take place on Tuesday, July 13, 2010 from 10-11 a.m. CST.

KIC will discuss a recent study conducted by the Rochester Institute of Technology and its practical application for achieving reliable, non-destructive methods of profiling sensitive, critical components such as BGAs. This study demonstrates the merits of various thermocouple attachment methods and how common practices are now being questioned since they are seen to have a negative impact on modern profiling reliability.

Based on these new findings, KIC will discuss strategies for profiling complex PCBs that do not require drilling holes or using other destructive techniques. Additionally, creating offsets as well as balancing boards, forward capability and hybrid profiles will be discussed. KIC also will focus on existing software and hardware solutions that do not require sacrificing production boards for profiling purposes. These measures, along with the new RIT study, will provide modern manufacturers with the tools to produce quality product without waste.

Brian O’Leary is the Americas sales manager for KIC. His area of expertise includes innovative concepts on improving processes with solutions for improving yields. O’Leary also has developed a book, Profiling Guide for Profitability, and “The Profiling Guru” Web site, featuring profiling tips, energy conservation, and more advanced concepts, along with videos and podcasts: www.profilingguru.com.