Data analytics to drive smart manufacturing whitepaper
The fabless semiconductor manufacturing sector is increasing in popularity, offering a simple outsourced manufacturing solution that enables smaller semiconductor companies to focus on innovation. However, many fabless semiconductor suppliers must deal with an extensive network of supply-chain partners that generates large amounts of data. This data can be used to support defect traceability, but putting it all together to identify actionable knowledge is challenging.
Technologies are now available that make it possible for fabless semiconductor suppliers to combine and analyse the many data streams they receive from their supply-chain partners.
In the current global semiconductor ecosystem a wide range of manufacturing technologies and processes are available for wafer fabrication, testing, and assembly.
Fabless integrated circuit (IC) manufacturers successfully leverage these technologies while at the same time they benefit from the capital efficiency offered by outsourced manufacturing.
Recent innovations in silicon scaling, and packaging technologies allow for the ever-increasing levels of integration in multichip modules and system-in-package (SIP) technologies.
Increased levels of integration of components and technologies lead to an overall increase in functionality and better performance at lower costs. On the downside however for IC manufacturers, such complex integration schemes also come with many operational challenges that are associated with technological complexities and operational challenges.
Find out more from the whitepaper below.
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