Acculogic Launches ThermoScan™ Test Technology

21st September 2010
Posted By : ES Admin
Acculogic Launches ThermoScan™ Test Technology
Acculogic’s Manufacturing Test Systems Division introduces its ThermoScan™ test technology. The ThermoScan™ sensor can be installed on a flying probe shuttle for general application or a probe module with Z-movement for more accurate measurement over the integrated circuits (ICs).
Flying probe test systems have been replacing traditional fixture-based bed-of-nails (BON) in-circuit test (ICT) systems as the tester of choice for high-density printed circuit boards (PCBs) with small or no test pads. The complexity and high level of integration inherent in the use of fine-pitch and ball grid array (BGA) IC technologies has significantly reduced the available space. Increasing board complexity also limits the effectiveness of conventional inspection and test strategies.

Acculogic’s Flying ThermoScan™ uses the mechanical capability of its flying probe to automatically move an infrared temperature sensor over the PCB to measure the powered PCB temperature pattern. This new test method bridges the gaps between conventional test technologies.

Flying ThermoScan™ can be used at every stage of the production process. It can be used for design verification and helps to optimize the thermal distribution. This will increase the mean time between failure (MTBF) for products in the field, decreasing warranty cost. It also can be used to efficiently repair PCBs returned from the field. ThermoScan™ quickly provides useful troubleshooting information, dramatically reducing repair time.

Acculogic’s ThermoScan™ can measure and analyze the thermal behavior of single-sided and double-sided PCBs. The systems’ temperature range is from -18 to 220°C with a measurement accuracy of 3 percent. The ThermoScan™ sensor response time is 150 ms after a 1-2 minute warm-up time.

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