The Bergquist Company

Designed for structural-bonding applications requiring high thermal performance with absorption of mechanical stresses, the Bond-Ply LMS-HD has been released by Bergquist. The laminate material consists of a thermally conductive low-modulus silicone compound coated on a cured core and double lined with protective films.

Featuring a tough polyimide carrier to fulfil demanding automotive and industrial applications, the high-durability Gap Pad 1000HD thermal material has been introduced by Bergquist. The polyimide carrier maximises puncture and tear resistance and enhances handling characteristics, while also ensuring high dielectric breakdown voltage of over 10,000V.

The first in a line of low-volatility dispensable thermal interface materials, Bergquist has introduced Gap Filler 1500LV. The two-component liquid dispensable thermal interface material is optimised for applications such as LED lighting where designers need to minimise fogging of lenses or optics.

  Featuring a permanent polyester (PEN) liner that allows reworking and enhances mechanical compliance in low-stress applications, Bergquist announce that the Gap Pad 1450 has joined the Gap Pad family of thermally conductive gap filling thermal interface materials.