MARTIN / FINETECH

The unit can handle the complete QFN solder bumping process, even for the smallest pitches. Using unique Hotprint Technology, the mask is not removed after printing paste but remains on the QFN during reflow.

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Wisconsin/Great Lakes Expo and Tech Forum, scheduled to take place August 24, 2010 at the Wyndham Airport Hotel in Milwaukee, WI.

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.