congatec

congatec has introduced a new rugged class of embedded edge server technologies designed for the digitisation of the upstream and midstream oil and gas industry. Both sectors are characterised by distributed assets and infrastructures in harsh environments and therefore require ultra-robust embedded platforms for the digital transformation challenge that offers a huge potential for cost savings.

Supplier of standardised and customised embedded computer boards and modules, congatec, demonstarted the power of hard real-time communication over Gigabit-Ethernet at electronica 2018. This demonstration showed that real-time data, the base for most Industry 4.0 installations, can still be transmitted in time even when utilising a heavily loaded Ethernet connection.

At CIIF, China International Industry Fair in Shanghai, the Taiwan located subsidiary of congatec will present smart manufacturing IT platforms for 'Made in China 2025' (MIC 2025) solutions in hall 6.1H, booth A065. These instantly deployable computing platforms enable Chinese machine building and manufacturing systems engineers to develop smart, connected manufacturing equipment as well as robotics and intra-logistics devices with situational awareness for collaborative manufacturing.

congatec AG has appointed Axel Petrak as its new International Sales and Business Development Director. In this newly created position he will report directly to the CEO.

congatec AG announces that Technofonds Bayern (The Bavarian Technology Fund) of Bayern Kapital GmbH (Bavaria Capital) intends to increase its holding in the company by injecting a further one million Euros, together with a group of lead investors. Their total share holding will thereby increase to 11.1 %. congatec will utilise these funds for the continued expansion of its development activities, particularly in the field of energy-saving computer modules for mobile applications. A sizeable portion of the funds will also be allocated to financing the further growth of the business.

congatec AG announces the new conga-XA945 module as the latest addition to the companies successful ETX/XTX product family. This extremely low-power and attractively priced module features 4 PCI Express links instead of an ISA bus. The module is equipped with the Intel Atom™ Processor N270 and a fully-featured Mobile Intel 945GME Express chipset including the Intel I/O Controller Hub 7-M.

The Qseven Consortium announces that Foxconn Technology Group has joined the consortium, increasing the number of members to 25. The Qseven Consortium was founded in 2007 by congatec AG, Seco s.r.l. and MSC Vertriebs GmbH and has seen a steady increase in membership ever since.

congatec AG announces the immediate availability of Version 1.0 of the COM Express Design Guide for developers of COM Express modules.

congatec AG announces that the company will be further extending its design activities in the Czech Republic as of May 1, 2009. For this purpose congatec will be taking on the complete design team of a major business alliance partner. This team, situated in Brno, consists of eight experienced hardware and software engineers and will be concentrating on the development of customized carrier boards for Qseven, XTX and COM Express computer modules.

congatec AG presents the Qseven Mobility Starter Kit, a complete rapid prototyping package for battery-powered, embedded systems. The compact size and low power consumption of Qseven embedded computer modules makes them ideally suited for almost all ultra-mobile, embedded PC applications. In order to minimise the development effort required for such systems, congatec has bundled all the necessary components in a comprehensive starter kit.

congatec AG enhances its successful COM Express™ product family with the introduction of the conga-CAx, which utilizes the new industrial temperature versions of the ultra low power Intel® Atom™ processor Z5xx series and the Intel® System Controller Hub US15WPT.