PA&E

Design engineers in defense, aerospace and other industries where low weight and superior electrical performance are key considerations have a new option, following PA&E’s release of its new aluminum Micro-D connector.

Sealing Process Offers Highest Levels of Hermetic Performance, Greater Flexibility

Engineers designing electronic components for use in applications where non-magnetic characteristics are required now have a new connector option following PA&E’s announcement of its new non-magnetic Micro-D connector line.

Engineers who want to leverage Souriau’s light-weight, high-density microComp connector line in harsh environment applications can now shave even more weight off their design without compromising hermetic integrity, following with the new aluminum compatible microComp hermetic receptacle from PA&E.

Engineers designing electronic components that must operate reliably in harsh environments can now leverage the increased performance of fiber optic technology, following the release of PA&E’s new hermetic fiber optic bulkhead feedthru for the Souriau ELIO 38999 fiber optic connector line. This new, lightweight interconnect solution allows engineers to take advantage of fiber optics in applications where that technology was once unworkable due to hermetic requirements. And, it delivers truly hermetic performance at a significant (up to 60%) weight savings when compared to stainless steel alternatives.

Design engineers in defense, space, aviation, and other industries, where light weight and superior hermetic performance are key considerations, have a new option following PA&E’s release of its new aluminum circular 38999 DC connector.

PA&E will be highlighting its EMI filter, hermetic interconnect, and electronic packaging technology at the 2009 IEEE MTT-S International Microwave Symposium, held June 7-12 at the Boston Convention Center in Boston, MA. PA&E application engineers will be available in Booth 1827 throughout the show to discuss electronic component engineering challenges with attendees and to answer questions about the company’s products and integrated manufacturing capabilities.

Avionics systems depend on components that deliver absolute reliability regardless of environmental conditions and that’s why many leading avionics manufactures depend on PA&E’s hermetic connector, EMI filter and electronic packaging technology. PA&E will be showcasing these products along with its unique engineering and manufacturing expertise to avionics engineers and engineering managers at this year’s Avionics USA Expo, held June 1-2 at the San Diego Convention Center. PA&E application engineers will be on hand in booth 406 to answer questions relative to the design and manufacturing of hermetic connectors and packaging and explain PA&E’s approach to delivering products that perform reliability in the most demanding environments.

PA&E will be highlighting its hermetic interconnect, electronic packaging and EMI filter product lines at this year’s RadarCon 2009 conference, held May 4-8 at the new Pasadena Convention Center in Pasadena, CA. PA&E application engineers will be available in Booth 17 throughout the show to discuss electronic component engineering challenges with attendees and to answer questions about the company’s products and integrated manufacturing capabilities.

Seven thousand of the top scientists involved in physics research and applied physics will have the opportunity to learn more about PA&E’s innovative explosive metal welding and forming processes at the American Physical Society’s (APS) March meeting, held March 16-20 at the David L. Lawrence Convention Center in Pittsburgh, PA.

Titanium composite technology can produce electronic packages that are stronger and more reliable than aluminum alternatives, however, titanium’s thermal dissipation characteristics are inadequate for some applications. PA&E offers engineers the option of using integrated molybdenum/copper heat sinks and now, for applications where weight is a primary consideration, the company is offering an aluminum silicon carbide heat sink option.

Engineers designing electronics that require high-bandwidth fiber optic connectivity and must operate reliably in harsh conditions can now take advantage of the PA&E’s new FC/APC fiber optic bulkhead connector. This new hermetic connector can deliver new levels of reliability because it is designed to be laser welded into lightweight titanium or aluminum housings, thereby eliminating a key point of failure: solder joint fatigue.