Practical Components and PACTECH Offer Flip Chip Test & Evaluation Kit and Board

“Our dummy products are selected with care to be the finest factory quality components and our test boards and kits simulate real-world production,” said Practical Components President Kevin Laphen.
The PACTECH test die are combined with these test boards to provide customers with the ability to test a variety of specs and processes. Both components and test boards are daisy-chained for continuity.

For the Pac2.1-PB184-200-10mm-DC-305 die on the PCB310, there are two rows of seven pads. Additionally, it has 184 bumps and a bump pitch of 200 µm. For the Pac2.3-FA572-200/400-10mm-DC-305 die on the PCB310, there are two rows of seven pads. These components have 572 bumps and a pitch of 200 µm/400 µm.

The Evaluation Board is 6.3 x 3.95, has two layers and is 0.062 thick. Board material is High Temp-Tg and the standard board finish is OSP Entek CU-A-HT. As always, Gerber and X,Y Theta data are available at no charge.