Datapaq has solutions for monitoring all your soldering processes

To enhance the functionality of the standard profiling system, Datapaq can provide a solution for all soldering and curing processes within the electronic assembly environment.

Surveyor – designed specifically for Reflow processes enabling users to monitor oven performance quickly and easily

Rapid Oven Setup (ROS) – automatically calculates the optimum oven settings for any combination of oven, product and target profile

Wave Solder Pallet – enables you to monitor actual PCB/component temperatures and process stability

The heart of Datapaq’s temperature profiling system – Datapaq has used the most advanced technology available to ensure optimal performance for their range of temperature data loggers. The Q18 has been specially designed to profile all of the thermal processes found in the electronics assembly industry – it is now the most powerful, flexible and robust temperature data logger available. The Q18 takes readings at a faster speed, finer resolution and greater accuracy than has previously ever been available within the temperature profiling industry. Now available with up to 12 data channels, the Q18has an accuracy of ±0.5°C and can store up to 18,000 readings per channel.

Founded in 1984 Datapaq provides key information on the effectiveness of heat processing. With the use of the most advanced and tested techniques for accurately gathering and storing information, Datapaq has created industry specific standards to analyse and report information in a precise way. Recognised as the industry leader, Datapaq serves the automotive, paint finishing, textile processing, ceramic manufacturing, PCB surface mounting, metals heat-treating and food process industries worldwide.